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Quality

Acceptance first. Certificates second.

What matters on an HDI board is not whether we have a certificate on the wall. It is which acceptance class your board is being built to, and how we prove it before it leaves the building.

Circuit board on a workbench next to test equipment and hand tools.
Most HDI failures do not show up on a bench like this one. They show up after thermal cycling.
Acceptance class

Tell us the class before the quote, not after.

IPC-A-600Acceptability of printed boardsVisual, dimensional
IPC-6012 Class 2Qualification and performance, generalIndustrial, consumer, most commercial
IPC-6012 Class 3High reliability — tighter annular ring and platingAutomotive, medical, aerospace

Class 3 is not a grade we assign ourselves. Your drawing specifies it, and the annular ring, plating thickness and inspection frequency all change with it — which changes the price.

Inspection

What we check, and at which step.

Inspection on an HDI board has to happen during the buildup, not only at the end. A via that was filled badly is invisible once the next layer is laminated on top of it.

AOIInner-layer and outer-layer pattern defectsAfter etch · after outer imaging
Via fill inspectionDimple, void, copper fill completenessOn each buildup layer
CoplanarityHeld within 3 µmAfter planarisation
RegistrationLayer to layer, HDI budget ±25 µmPer lamination cycle
Electrical testContinuity and isolation against the netlistFinished board
MicrosectionBarrel plating, annular ring, via structureCoupon, per lot
Reliability

The failure we design against is the microvia, not the trace.

A microvia that fails does it after thermal cycling, not during electrical test. Copper fill quality and barrel integrity are what decide it, so those are the process controls we hold tightest, and IST thermal cycling is available as a qualification step.

IST thermal cyclingAvailable on request, coupon or boardQualification
Microsection on lot couponBarrel plating and annular ringPer lot
Via fill void checkCopper fill completeness and dimple depthPer buildup layer
Certification systems

The certification systems this industry is audited against.

ISO 9001Quality management systemAudited
IATF 16949Automotive supply chain qualityAudited
ISO 13485Medical device qualityAudited
ULLaminate and finished-board safetyListed
AS9100AerospaceAudited
IPC-6012 / IPC-A-600The acceptance classes referenced aboveStandard
ISO 9001 IATF 16949 ISO 13485 UL listed AS9100 IPC-6012 / IPC-A-600

Read this before you take the list above as a claim

This site is a design sample built on a placeholder brand. No certificate number is published here, and nothing on this page should be read as a claim that Nordvia Circuits holds any of these certifications. Certificate copies are provided with a real quotation.

Two-layer FR-4 circuit board with wide traces, seen flat from above.
Copper weight you can see

Finished copper on the traces is 18–25 µm. Heavy-copper areas change the etch and the imaging recipe, and they are worth flagging before the panel is booked rather than after the first lot.

18–25 µm plated copper
Four identical circuit boards arranged in a row on a light background.
Solder mask contrast at AOI

Mask colour sets the contrast the inspection system works against. Green and red give the imaging the most headroom; black and matte finishes need a different recipe and are worth flagging up front.

Set the AOI recipe early

Tell us the acceptance class and the qualification tests your programme requires, and the quote will carry them as line items instead of assumptions.

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