Who you are actually talking to.
Nordvia Circuits runs HDI work on dedicated buildup lines rather than adding a laser drill to a multilayer shop. This page is a design sample, so read the structure of how we work rather than the specifics — the specifics get replaced with a real factory's numbers.
HDI boards go to a line that runs HDI every day.
Core fabrication and the buildup layers are the same line, but the registration budget and the inspection frequency are not. Holding ±25 µm instead of ±50 µm is a discipline, not a machine setting.
Microvias are drilled by CO2 and UV lasers; the mechanical drilling that handles through-holes, power and ground stays on conventional equipment. Most HDI designs are hybrids, and that is the cost-effective way to build them.
Stackup engineering happens before production, not during it: via structure feasibility, aspect ratios and capture pad sizes are checked against the design, and DFM comments come back with the quote rather than with the first panel.
Three steps, and the second one is the one that matters.
The fastest way to know whether we are the right line for your board is to send one.
Engineering reply within 12 hours